HMP-2668
Epoxy Hardener
Description
HMP-2668is an anhydrous and solvent-free phenalkamine epoxy curing agent.
Formed by the reaction of phenol, formaldehyde, and ethylenediamine. It is a
transparent brown viscous liquid, readily soluble in organic solvents such as acetone,
ethanol, and xylene, slightly soluble in water, and has minimal toxicity. Its molecular
structure contains active hydrogen from aliphatic amines, along with functional
groups that catalyze and accelerate epoxy resin curing, plus a benzene ring structure.
Compared to aliphatic amines, it exhibits stronger hydrophobicity, enabling epoxy
resin curing at low temperatures around 0°C. It can also fully cure various epoxy
resins under relative humidity exceeding 90% or underwater conditions.
Parameter
Appliance
●Anti-corrosion Coatings.
●Metal Corrosion Protection coatings.
●Grouting.
●Concrete Coatings.
Characteristics
●Fast curing speed, high bonding strength.
●Highly resilient and impact-resistant.
●Provides excellent corrosion protection when applied to the surface of the
substrate.
Package Loading
200kg/ iron barrel.
16mt/1*20FCL with pallet.
中文
Buy 
Consulting 
